Electronic Wafer Mow
Client requirements
The workstation receives the Silicon Wafers pre-cut and assembled on supporting frame and tape, orients the angle of the wafer, stretches the tape and lifts the single component for Pick and Place.
Activity carried out by JORIO
- processing 6 and 8 inc. wafers.
- Wafer angle controlled rotation >180°.
- automated control of the tape stretching.
- vacuum enabled tape block.
- lifting of the silicon component enabled by automated extractors.